The MVP‑3100 is a rugged, high-performance fanless embedded computer that supports Intel® Core™ 200S series and 14th/13th/12th Generation Core™ processors. Designed for 24/7 operation in extreme environments, it offers the following features:
- Excellent thermal design: Stable operation over a wide temperature range of -20°C to +60°C maintains high performance even under harsh temperature conditions.
- Flexible Modular I/O Expansion: Built-in ADLINK Flexible Expansion Module (AFM) slots enable customized I/O configurations based on application requirements, enhancing connectivity flexibility.
- The MVP utilizes a modular bare-metal design with a separate chassis and motherboard, allowing customers to quickly build systems tailored to end-user needs and significantly shortening lead times.
- Clear and intuitive graphical SOP documentation makes assembly and disassembly efficient and simple; users can easily install the CPU and other components, and upgrade memory and storage devices.
